2018 IEEE 59th International Scientific Conference on Power and Electrical Engineering of Riga Technical University (RTUCON).

Intention of the organizers is to give an opportunity to scientists, engineers and manufacturers as well as to doctoral students from all over the world to meet and discuss recent development and their achievements in the area of power and electrical engineering.

Technically sponsored by: Riga Technical University, IEEE Industry Application Society, IEEE Latvia Section and IEEE Latvia IAS-IES-PELS Joint Chapter. All papers accepted and presented at the conference will be submitted to IEEE Xplore database and later will be cross-referred in SCOPUS and in Thomson-Reuters Web of Science. 20% of accepted papers will be recommended for publication in IEEE Transactions on Industry Applications. 20% of accepted papers will be recommended for publication in journal Electrical, Control and Communication Engineering (ECCE)


Keynote Lecturers

Frede Blaabjerg

Frede Blaabjerg (S’86–M’88–SM’97–F’03) was with ABB-Scandia, Randers, Denmark, from 1987 to 1988. From 1988 to 1992, he got the PhD degree in Electrical Engineering at Aalborg University in 1995. He became an Assistant Professor in 1992, an Associate Professor in 1996, and a Full Professor of power electronics and drives in 1998. From 2017 he became a Villum Investigator. He is honoris causa at University Politehnica Timisoara (UPT), Romania and Tallinn University of Technology (TTU) in Estonia.

His current research interests include power electronics and its applications such as in wind turbines, PV systems, reliability, harmonics and adjustable speed drives. He has published more than 500 journal papers in the fields of power electronics and its applications. He is the co-author of two monographs and editor of 7 books in power electronics and its applications.

He has received 26 IEEE Prize Paper Awards, the IEEE PELS Distinguished Service Award in 2009, the EPE-PEMC Council Award in 2010, the IEEE William E. Newell Power Electronics Award 2014 and the Villum Kann Rasmussen Research Award 2014. He was the Editor-in-Chief of the IEEE TRANSACTIONS ON POWER ELECTRONICS from 2006 to 2012. He has been Distinguished Lecturer for the IEEE Power Electronics Society from 2005 to 2007 and for the IEEE Industry Applications Society from 2010 to 2011 as well as 2017 to 2018. In 2018 he is President Elect of IEEE Power Electronics Society.

He is nominated in 2014, 2015, 2016 and 2017 by Thomson Reuters to be between the most 250 cited researchers in Engineering in the world.

Power electronics - quo vadis

The world is becoming more and more electrified combined with that the consumption is steadily increasing – at the same time there is a large transition of power generation from fossil fuel to renewable energy based which all together challenges the modern power system but also gives many opportunities. We see also now big steps being taken to electrify the transportation – both better environment as well as higher efficiency are driving factors. One of the most important technologies to move this forward is the power electronics technology which has been emerging for decades and still challenges are seen in the technology and the applications it is used. This presentation will be a little forward looking (Quo Vadis) in some exciting research areas in order further to improve the technology and the systems it is used in. Following main topics will be discussed

The evolution of power devices
Renewable Generation
Reliability in power electronics
Power Electronic based Power System stability

At last some discussions about other hot topics will be given.

Donatas Mishkinis

Engineering Manager and Principal Designer with vast, more than 25 years of experience in developing innovative, customer- oriented products, systems and solutions for electronics thermal management applications.

Professional experience obtained from working in different R&D organizations and environments: academic research institute (Luikov Heat & Mass Transfer, Belarus, 9 yrs.), higher educational establishment (Clemson University, USA, 2 yrs.), government research laboratory (Canadian Space Agency, Canada, 3 yrs.), industry (IberEspacio, Spain, 10 yrs. and Allatherm, Latvia, 2 yrs.).

PhD in thermal engineering with dissertation dedicated to heat pipe applications in natural gas adsorption storage systems and heat pumps.

Winner of HISPASAT 25th Anniversary Prize: Best Telecommunications Satellite Innovation Project.

Holder of George Grover Award in recognition of outstanding contribution to the development of science and technology of heat pipes.

Author of 12 patents and more than 100 scientific papers and chapters in books.

Advanced Thermal Management in Electronic Packaging

Modern trends in electronic packaging and integration lead to extremally high power density designs. Thermal management is getting critical issue for further development of micro- and power electronic industries. Undeniably, that novel innovative approaches: advanced heat transfer materials and processes are necessary to answer the thermal challenges. Today, along with new electronic packaging developments, the role of thermal management is a key issue to assure effective package design.

Metallic heat sinks and straps, liquid cooled cold plates (including microchannels designs), thermal electric coolers (Peltier elements) heat pipes and vapor chambers are widely used for thermal control in nowadays electronics, but these technologies are reaching the limit and cannot provide the solutions for future levels of powers, power densities, integration and miniaturization needs.

Heat Loops known as Loop Heat Pipes, Capillary Pumped Loops, Mechanically Driven Loops, Two-phase Loops, Hybrid Loops, etc., are the next generation of thermal management systems. As well as in Heat Pipes, the evaporation/condensation closed cycle also being used in Heat Loops as highly efficient heat transfer mechanism.

The main advantages of the Heat Loops are (1) capability to manage high power densities due to special design of the evaporator and (2) great flexibility in integration to electronic package due to the fine diameters of fluid transport lines. In addition, Heat Loops can efficiently transfer power against gravity, which is not the case for traditional Heat Pipes.

A trade-off and an overview of electronic cooling technologies. Trends, potential and current applications of the technology in different industries for electronics cooling are reviewed.


Technical Tracks

Implementation, Protection and Thermal Design of Power Semiconductor Switches
New Topologies and Topological Improvements of Power Electronic Converters
Design Issues of Power Electronic Converters
Applications of Power Electronic Converters

Theory and Analysis of Electrical Machines and Drives
Design and Maintenance of Electrical Machines and Drives
Reliability and Lifetime Analysis of Electrical Machines and Apparatus

Transformers, Relays and Other Electrical Apparatus
Industrial Robotic Systems
Theory, Analysis and Design of Other Electrical Equipment
Safety and Reliability of Electrical Equipment
Electromagnetic Compatibility of Electrical Equipment
Electric Power Supply

Power System Control, Automation, Stability and Protection
Power Quality and Reliability
Power Plants, Renewable and Distributed Energy Systems
Power System Planning, Management and Economic Evaluation
Power System Risk Assessment and Management
Electricity Market

Energy Management in Buildings
Smart Grid for Energy Economy and Financial Management
Intelligent Energy Measurement and Monitoring
Smart Grid and Plug-In Vehicles
Power Converters and Control Equipment for Smart Grids

Information Technologies in Electrical Engineering
Information Technologies in Power Engineering
Intellectual Transport Systems

Adaptive Electrical, Mechatronic and Robotic Systems
Electronics and Communications for Biology and Medicine
Tools of Human-to-Machine Interaction
Tools of Machine-to-Machine Interaction
Electronics for Energy Harvesting
Hardware and Software Tools for Signal Processing
Electronics and Communications for Sensor

Methodology of Electrical and Power Engineering Education
Tools of Electrical and Power Engineering Education
Distance Education in Electrical and Power Engineering


Technically sponsored by:
RTU IEEI IAS IEEI LV IEEI LV Joint Chapter